2011 Broadband World Forum


Broadcom Drives High-Speed Broadband, Triple Play Services and Whole-Home Connectivity at BBWF 2011

Leveraging Broadcom's proven ability and leadership in xDSL, new products fuel breakthrough Internet speeds, high-bandwidth triple play services and reliable in-home networks.

High degrees of integration enable unprecedented levels of cost efficiency, energy management and small form factors, extending broadband services to more households and at lower costs.

Showcased at BBWF, Broadcom's latest reference designs will usher in new applications for home automation and whole-home connectivity, driving the next connected home revolution.

Visit Broadcom at BBWF 2011, September 27-29, in Paris (invitation only).


Tradeshow Highlights

  • Broadcom designs the industry's first xDSL Integrated Access Device SoC that integrates multi-mode ADSL2+ / VDSL2, 802.11n, DECT, VoIP and Ethernet Switching, enabling seamless distribution of voice, video and data services throughout the home.
  • Proliferating higher-speed Internet, IPTV and mobile broadband services, Broadcom's latest VDSL2 Central Office SoC integrates G.vector, removing crosstalk noise for higher performing networks at lower costs.
  • For an easier plug-n-play connected home, Broadcom's industry's first single chip Powerline Networking SoC is a key addition to its strong and diverse home networking standards portfolio.
  • New reference designs based on the BCM63168 xDSL IAD SoC will enable multi-mode whole-home connectivity with Wi-Fi and PLC, and high performance triple play with dual-band concurrent Wi-Fi. Additional applications include home automation with DECT Ultra Low Energy (ULE) capability and advanced VDSL physical layer rates with G.vector and Channel Bonding.
         

News Highlights

Broadcom Announces Industry's First Central Office VDSL2 Chipset With Integrated G.Vector Technology


  • First VDSL2 central office chipset to integrate G.vector, the ITU-T's newest standard to reduce DSL crosstalk noise
  • G.vector substantially increases VDSL2 coverage, almost doubling reach of 50Mbps and 100Mbps services to 1km and 400m respectively
  • Support for high-density line-card level vectoring while scalable to chassis level vectoring for large nodes
  • Drives deployment of superior next generation IPTV and mobile broadband capacity and copper plant manageability, and extends service reach to more households while reusing existing copper infrastructure

Broadcom Announces Industry's First 40nm Single Chip HomePlug® AV and IEEE 1901 Powerline Device


  • Increases in-home network coverage for an easier plug-n-play connected home experience.
  • Achieves industry's highest level of integration, energy efficiency and smallest form factor, reducing overall costs and enabling new Powerline form factors.
  • Drives adoption of interoperable HomePlug® AV in entertainment, home control and automation, and energy management applications in the next generation connected home.

Broadcom Unveils Breakthrough Integration on xDSL Integrated Access Device Platform


  • Industry's first all-in-one IAD SoC to integrate multi-mode ADSL2+/VDSL2, supporting channel bonding and G.vector with 802.11n, DECT, VoIP and Ethernet Switching into a single chip.
  • Leverages Broadcom's leadership in xDSL to provide significant cost and power savings in a smaller footprint.
  • Broadcom demonstrations at BBWF will feature next gen reference designs, ushering in new applications for home automation and whole home connectivity.
         


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