Neil Y. Kim

Executive Vice President, Operations and Central Engineering

Neil Kim serves as Broadcom's Executive Vice President, Operations and Central Engineering. In this role, he is responsible for all manufacturing activities including foundry operations and supply chain management. Under his leadership, Broadcom ships nearly 2 billion chips per year. Mr. Kim is also responsible for the development of analog mixed-signal and wired radio frequency (RF) technologies, manufacturing engineering and Broadcom's library of core technologies including process technology direction, electronic design automation (EDA) and corporate quality assurance.

Mr. Kim joined Broadcom in 2000 and has held a variety of senior management positions including Senior Vice President and Vice President of Central Engineering and Senior Vice President of Operations and Engineering.

Prior to Broadcom, he held a series of progressively senior technical and management positions at Western Digital Corporation, a data storage manufacturer, most recently serving as Vice President of Engineering.

Mr. Kim served on the board of the Global Semiconductor Association from 2009 to March 2015 and is now acting in an ongoing advisor role. He received a B.S.E.E. from the University of California, Berkeley.