Press Release

Broadcom's Single-Chip Satellite Multi-TV Set-Top Box Solutions Selected by EchoStar

Highly Integrated Chips First to Enable a Single Direct Broadcast Satellite

              (DBS) Set-Top Box to Support Multiple Televisions

IRVINE, Calif., Dec. 8 /PRNewswire-FirstCall/ -- Broadcom Corporation (Nasdaq: BRCM), a leading provider of silicon solutions enabling broadband communications, today announced that EchoStar Communications Corp. (Nasdaq: DISH) is using a combination of Broadcom® chips in its new DISH Network™ DISH 322 and Dish Player-DVR 522 satellite set-top boxes. The greatest advantage Broadcom's chips offer EchoStar is the ability, for the first time, to support multiple TVs with a single set-top box, which lowers the overall cost of supporting DBS service in households with multiple televisions.

The DISH 322 uses the BCM7319, a satellite set-top box decoder that integrates the equivalent functionality of two separate set-top boxes into a single chip. With this advanced capability, the DISH 322 can deliver DBS programming to multiple televisions in different areas of a home. Each television is independently supported, allowing multiple viewers complete flexibility to watch their own choice of programming simultaneously.

Building on this integration, the Broadcom BCM7320 decoder chip provides multi-television or PIP support as well as digital video recording (DVR) capability in the Dish Player-DVR 522. The BCM7320 enables the DVR 522 to support independent DVR television viewing in separate rooms of the home simultaneously. In a single television environment, the BCM7320 enables the DVR 522 to allow the consumer to view two separate programs with PIP capability or, alternatively, to support watch-and-record DVR capability with common DVR functions such as pausing live programming, recording, and forwarding and reversing through recorded programs.

EchoStar's DISH 322 and Dish Player-DVR 522 also incorporate Broadcom's BCM4500 Advanced Modulation Satellite Receiver and BCM3440 Digital Satellite Tuner. The BCM4500 receiver chip offers EchoStar 8PSK advanced modulation and turbo coding technology that increases information throughput by 35 percent in a given bandwidth or radio frequency link with no additional power requirements. The BCM3440 is a CMOS-based direct conversion satellite tuner chip specifically designed to support systems based on the BCM4500. The BCM7319 and BCM7320 both interface directly to the BCM4500 and BCM3440.

"Our typical customers have multiple TVs, which we can now address from a single set-top box without compromising the individual viewer's flexibility and access to programming," said Dave Kummer, Senior Vice President of Engineering/Manufacturing at EchoStar. "Broadcom's advancements in set-top box technology are evident in their product supporting multiple TVs. We believe that the addition of both basic and DVR set-top boxes with multiple TV capability will be a big win for our customers."

"We have worked closely with EchoStar to answer its product requirements by leveraging our technology and integration expertise," said Daniel A. Marotta, Vice President of Broadcom's Broadband Communications Group. "The result is that EchoStar can provide its typical customer, who has multiple televisions, a flexible single set-top box solution that provides access to the wide variety of DISH Network's programming in different rooms in the house."

Product Features

The BCM7320 is a highly integrated single-chip satellite set-top box decoder that incorporates dual QPSK receivers, an MPEG-2 A/V decoder, MIPS64™ CPU and peripherals. It is the first complete DBS set-top box solution to decode two transport streams, delivered either via the external dual BCM3440 CMOS tuners or via the IDE host I/F from an external hard disk drive, or any combination thereof, and display the resulting decoded audio and video on two TV monitors connected to the same set-top box. The Broadcom 2-D graphics engine incorporated into the chip offers true studio-quality text and graphics with extremely efficient use of memory and bandwidth. PVR capability in the chip offers personal viewing and scheduling, video-on-demand (VOD), and VCR "trick mode" effects on both TVs simultaneously.

With the exception of PVR capability and the on-board QPSK demodulators, the BCM7319 offers the same functionality as the BCM7320. Broadcom has developed and delivers device drivers that support industry-standard operating systems, enabling rapid software development for system designs for satellite customers.

The BCM7319 and BCM7320 are currently in full production. The chips are each packaged in a 456-pin PBGA and are priced at $50 and $60, respectively, in 10K quantities.

About Broadcom

Broadcom Corporation is a leading provider of highly integrated silicon solutions that enable broadband communications and networking of voice, video and data services. Using proprietary technologies and advanced design methodologies, Broadcom designs, develops and supplies complete system-on-a- chip solutions and related hardware and software applications for every major broadband communications market. Our diverse product portfolio includes solutions for digital cable and satellite set-top boxes; cable and DSL modems and residential gateways; high-speed transmission and switching for local, metropolitan, wide area and storage networking; home and wireless networking; cellular and terrestrial wireless communications; Voice over Internet Protocol (VoIP) gateway and telephony systems; broadband network processors; and SystemI/O™ server solutions. These technologies and products support our core mission: Connecting everything®.

Broadcom is headquartered in Irvine, Calif., and may be contacted at 1-949-450-8700 or at

Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995: All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with the BCM7319, BCM7320, BCM4500, and BCM3440 products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the continuing significant economic slowdown and volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for DBS silicon applications; delays in the adoption and acceptance of industry standards in those markets; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; our ability to retain and hire key executives, technical personnel and other employees in the numbers, with the capabilities, and at the compensation levels needed to implement our business and product plans; the availability and pricing of third party semiconductor foundry and assembly capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the loss of a key customer; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a timely manner; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; the volume of our product sales and pricing concessions on volume sales; the effects of new and emerging technologies; changes in our product or customer mix; intellectual property disputes and customer indemnification claims and other types of litigation risk; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.

Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement for any reason.

Broadcom®, the pulse logo, Connecting everything® and SystemI/O™ are trademarks of Broadcom Corporation and/or its affiliates in the United States and certain other countries. EchoStar® and DISH Network™ are trademarks of EchoStar Communications Corporation. MIPS64™ is a trademark of MIPS Technologies, Inc. All other trademarks mentioned are the property of their respective owners.

     Broadcom Trade Press Contact:
     Laura Brandlin
     Director of Marketing Communications

     Broadcom Business Press Contact:
     Bill Blanning
     Sr. Director, Corporate Communications

     Broadcom Technical Contact:
     Nicholas Dunn
     Product Line Manager

     Broadcom Investor Relations Contact:
     T. Peter Andrew
     Sr. Director, Investor Relations
SOURCE  Broadcom Corporation
    -0-                             12/08/2003
    /CONTACT: Trade Press Contacts: Laura Brandlin, Marketing Communications,
+1-949-926-5108,, Business Press Contact: Bill Blanning,
Sr. Director, Corporate Communications, +1-949-926-5555,, Technical Contact: Nicholas Dunn, Product Line Manager,
+1-408-922-7391,, or Investor Relations Contact: T. Peter
Andrew, Sr. Director, Investor Relations, +1-949-926-5663,, all of Broadcom Corporation/
    /Web site: /

CO:  Broadcom Corporation; EchoStar Communications Corp.
ST:  California

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0024 12/08/2003 09:00 EST