LAS VEGAS, NetWorld+Interop 2004, May 11, 2004 /PRNewswire-FirstCall via COMTEX/ -- Broadcom Corporation (Nasdaq: BRCM), a leading provider of highly integrated semiconductor solutions enabling broadband communications, today announced a low power, multi-rate serial 10 Gigabit transceiver (transmitter/receiver) that enables networking equipment manufacturers to standardize on a single chip design supporting both Very Short Reach (VSR) and Long Reach (LR) optical link applications. Broadcom's new transceiver is especially suited for LR applications, providing peak performance and a small footprint for compact module and high-density line card solutions.
The Broadcom(R) BCM8152 multi-rate Gigabit transceiver is targeted for both module and line card applications. For module applications, the low jitter generation and ability to adjust the phase and threshold of input signals allow an optical module to achieve longer reach. For line card system applications, high port density within a small footprint is achieved. For this application, a special 10 Gigabit serial receiver is designed to improve the eye opening of the received signal in support of the 10 Gigabit small form factor interface (XFI) as specified by the 10 Gigabit Small Form Factor Pluggable (XFP) Group.
Modules and high-density line cards take electrical signals and convert them to serial optical signals for transmitting and receiving data throughout an optical network (which is the preferred method used to transmit data at high speeds over long distances). The BCM8152's small form factor is designed to reside within 10 Gigabit hot-pluggable modules and high-density line cards for optical switches and routers within metropolitan area networks (MANs), multi-service switching platforms, add and drop multiplexers (ADMs) and Dense Wave Division Multiplexing (DWDM) transport equipment.
According to Dell'Oro Group's "4Q 2003 Router Summary Report," there is an increase in demand for both 10G POS (Packet over SONET/SDH - Synchronous Optical Network/Synchronous Digital Hierarchy) ports and 10 Gigabit Ethernet (GbE) ports, and it is expected that 10 Gigabit per second (Gbps) router revenue will grow 31% year-over-year in 2004. SONET and SDH are networking standards for transmitting data at high rates over fiber optic lines.
The BCM8152 is a fully integrated, Multi Source Agreement (MSA) compatible, multi-rate transceiver that operates at high speed transmission rates supporting OC-192/STM-64 (9.953 Gigabits per second), 10 Gigabit Ethernet (10.3125 Gbps), 10 Gigabit Fibre Channel (10.519 Gbps) or one of the supported forward error correction (FEC) rates (10.664, 10.709, 11.095 and 11.318 Gbps). With low jitter generation of 200 femtoseconds (or 2mUI RMS), the BCM8152 provides ample margin for designs required to meet the ITU and Telcordia maximum limit of 10mUI RMS for jitter generation.
"For wideband tunable 300-Pin MSA transponders to address long haul applications, low jitter and the ability to adjust the phase and threshold for control are required when providing this type of high-quality and reliable transponder," said Jerry B. Wood, Director of Harris Corporation, Government Communication Systems Divisions. "The BCM8152 met our performance requirements the best and is targeted to address the needs of long reach and long haul applications."
"The BCM8152 is a third generation 10 Gigabit optical transceiver that sets new levels of flexibility and performance in a single chip, CMOS device. Broadcom has continued to invest in transceiver development to enable the transition of networking equipment to 10 Gigabit data transmission by continuing to offer high performance, cost-effective solutions," said Nariman Yousefi, Vice President and General Manager of Broadcom's Networking Physical Layer/Optical Line of Business.
BCM8152 Technical Information
The BCM8152 transceiver offers a high level of silicon integration including a 16:1 multiplexer, 1:16 demultiplexer, clock multiplier unit, and clock and data recovery unit with a limiting amplifier. Low cost is achieved through the use of a standard CMOS process and a small 15 x 15 mm plastic BGA package.
Price and Availability
Samples of the BCM8152 are currently available to all Broadcom customers. Production is scheduled for July 2004 with large volume pricing at $91 each.
Reference designs for BCM8152 XFP applications are also available to accelerate time-to-market for low-cost line card and interconnect solutions based on the XFP module specification. The XFP reference design includes an evaluation board, reference schematics, a user manual, and software with a graphical user interface (GUI). A standard BCM8152 evaluation board is also available for customer evaluation.
Broadcom Corporation is a leading provider of highly integrated semiconductor solutions that enable broadband communications and networking of voice, video and data services. We design, develop and supply complete system-on-a-chip (SoC) solutions incorporating digital, analog, radio frequency (RF), microprocessor and digital signal processing (DSP) technologies, as well as related hardware and software system-level applications. Our diverse product portfolio addresses every major broadband communications market, and includes solutions for digital cable and satellite set-top boxes; high definition television (HDTV); cable and digital subscriber line (DSL) modems and residential gateways; high-speed transmission and switching for local, metropolitan, wide area and storage networking; home and wireless networking; cellular and terrestrial wireless communications; Voice over Internet Protocol (VoIP) gateway and telephony systems; broadband network and security processors; and SystemI/O(TM) server solutions. These technologies and products support our core mission: Connecting everything(R).
Broadcom is headquartered in Irvine, Calif., and may be contacted at 1-949-450-8700 or at www.broadcom.com.
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All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.
Important factors that may cause such a difference for Broadcom in connection with its BCM8152 transceiver products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for enterprise and consumer networking applications; delays in the adoption and acceptance of industry standards in those markets; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; our ability to scale our operations in response to increases in demand for our products and services; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the availability and pricing of third party semiconductor foundry and assembly capacity and raw materials; our ability to retain and hire key executives, technical personnel and other employees in the numbers, with the capabilities, and at the compensation levels needed to implement our business and product plans; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the loss of a key customer; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a timely manner; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; the volume of our product sales and pricing concessions on volume sales; the effects of new and emerging technologies; changes in our product or customer mix; intellectual property disputes and customer indemnification claims and other types of litigation risk; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.
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