CHICAGO, Oct. 30, 2012 /PRNewswire/ -- 4G World 2012 --
- Demonstrates full network portfolio of switch, processors, wireless infrastructure and microwave solutions
- Unveils new DFE development platform for faster system deployment and lower cost of ownership
- Best of 4G World Awards winner for BCM56240 small cell solution
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced it will demonstrate its complete portfolio of end-to-end solutions for the mobile network at 4G World Chicago, including switch, small cell, processor and microwave solutions. The company will also unveil its new Digital Front End (DFE) development board with VersaLineTM DPD technology for faster wireless system deployments and significantly lower total cost of ownership. Visit www.broadcom.com to learn more.
Spanning the network—from the access point to the edge, to the aggregation and the core—Broadcom's high-bandwidth, end-to-end solutions support the mobile experience consumers crave with high quality voice connections, faster app downloads and uninterrupted video streaming. Broadcom's focus on the wireless infrastructure market is highlighted through the recent sampling of its 28 nanometer (nm) dual-core XLP-200 series communications processor, which provides an ideal solution for scalable small cell designs simultaneously supporting 3G, 4G and 5G WiFi. Volume shipments of 40nm XLP-300 series processors are
ramping in wireless base station, radio network controller, mobile core and cloud applications.
The new BCM51030 DFE development board is designed to speed development of multi-protocol radio systems for macro and small cell base stations. The board ships with the components for a complete transmit loop, with the exception of the customer's selected driver and power amplifier (PA). Boards are now available with 1, 2 or 4 transmit channels and can support any protocol combination, any PA technology or architecture, and any frequency band with appropriate analog filter.
Broadcom's microwave system-on-a-chip (SoC) solutions enable mobile operators to manage the evolution of 4G/LTE networks and backhauling data from the cell sites to the core network. With unparalleled integration, the BCM85620 and BCM85810 SoCs combine the functionality of up to ten off-the-shelf application-specific standard parts (ASSPs) into a single chip, dramatically lowering power consumption and system cost.
Best of 4G Award Winner
The Best of 4G Awards recognize leaders in the development and deployment of 4G technologies. Broadcom has been named the winner of the "Mobile Backhaul and Core Network Innovation" category for its BCM56240 SoC solutions, which are the first small cell Ethernet switches to integrate traffic management and deep packet buffering and address the economic and performance challenges of operators and service providers as they upgrade legacy mobile networks.
Broadcom's Ran Soffer, Director of Product Marketing for Microwave Solutions, will present the "Business Case for Deploying Small Pico and Microcells" at 4G World on Wednesday, October 31, 2012 from 1:45 p.m. to 2:45 p.m. CDT. The session will examine the market need for higher capacity and better performance microwave connectivity and explore the issues and viable solutions to support the needs of mobile backhaul networks, such as capacity, networking, synchronization, power, scalability and cost.
- Exponential wireless traffic growth, limited spectrum challenging networks/driving need for new solutions1
- Greater than $600M in processor SAM for wireless infrastructure expected by 20152
- Move to LTE and multi-mode operation forcing need for 2x2 or higher MIMO
- Nine million subscribers are on LTE today out of 3.6 billion cellular users worldwide3
- 15 million macro transceiver TX and RX DFE channels expected to ship by 20164
- HetNet deployments to solve spectrum issues require scalability (2-16+ antennas, low-high bandwidths)
- Small cell solution adoptions for increased spectrum reuse with integrated 3G, 4G and WiFi support
All of Broadcom's demonstrated solutions for the mobile network at 4G World, McCormick Place, Chicago (Booth #938) are now sampling, including the BCM51030 DFE development board, XLP-200 and XLP-300 series, BCM56240, BCM85620 and BCM85810.
Rajiv Ramaswami, Broadcom's Executive Vice President & General Manager, Infrastructure and Networking Group
"Broadcom's end-to-end solutions are redefining the mobile experience with enhanced connectivity and a more reliable network. Our latest high-bandwidth, market-leading solutions such as the world's first 28nm multicore communications processor and Digital Front End development kit continue to enable the next generation of mobile infrastructure build out to support the mobile experience consumers crave, while our proven engineering such as the 4G World Award-winning BCM56240 for mobile backhaul continues to lead the industry."
1 CISCO Visual Networking Index, 2012
2 Linley Group's High Performance Embedded Processor Report, 2011
3 Rick Merritt, EE Times, March 1, 2012
4 Mobile Experts Macro Base Station Transceiver Report, 2012
Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.
Broadcom®, the pulse logo, Connecting everything®, and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.
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SOURCE Broadcom Corporation; BRCM Infrastructure & Networking