Single-chip 802.11n solution, designed using 65 nm CMOS processes and combines all of the elements of a Wireless Local Area Network (WLAN) subsystem — including power amplifiers — onto a single silicon die.
As a result of this integration, the new Intensi-fi® solution is half the size of previous solutions and can reduce manufacturing costs by up to 40 percent. In addition, the BCM4322 is the first solution to enable Wi-Fi™ products to achieve over 200 Megabits per second (Mbps) of actual wireless throughput to support several simultaneous multimedia applications.
Single-chip all-in-one die Baseband/MAC/Radio for 2x2 802.11n applications
802.11n Draft 2.0 compliant Wi-Fi solution. Fully compatible with IEEE 802.11n Draft 1.0 and 802.11a/b/g legacy devices.
Single-chip 65nm solution and high system integration drives down the cost of 802.11n solutions to enable a new generation of media/consumer applications
CMOS (Complimentary Metal-oxide Semiconductor) integration and low-power modes result in a 50 percent power reduction compared to previous generation solutions