MiniCard reference design is the world's first single-chip 802.11n solution.
Designed using 65 nanometer CMOS processes, the BCM4322 combines all of the elements of a wireless LAN subsystem — including power amplifiers — onto a single silicon die. As a result of this integration, this Intensi-fi® solution is half the size of previous solutions and can reduce manufacturing costs by up to 40 percent. In addition, the BCM4322 is the first solution to enable Wi-Fi products to achieve over 200 Megabits per second (Mbps) of actual wireless throughput to support several simultaneous multimedia applications.
Single-chip all-in-one die Baseband/MAC/Radio and power amplifier for 2x2 802.11n applications
802.11n Draft 2.0-compliant Wi-Fi solution. Fully compatible with IEEE 802.11n Draft 1.0 and 802.11a/b/g legacy devices.
Single-chip 65 nm solution and high system integration drive down the cost of 802.11n solutions to enable a new generation of media/consumer applications
CMOS integration and low-power modes result in a 50 percent power reduction compared to previous-generation solutions