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Single-Chip Solutions Cut Headset Re-Charge Time by Factor of Five and Deliver 200% Increase in Talk Time
The Broadcom BCM20740 family of Bluetooth 3.0 headset solutions leapfrogs the competition by delivering superior audio quality, key user interface enhancements, and, as the industry's first 65 nanometer (nm) CMOS Bluetooth headset chips, offers unrivaled talk time and power performance. This new family of headset solutions adds powerful 'industry-first' features, including new wind-noise reduction algorithms, multi-language 'Voice Prompt' technology and integrated fast-charging power innovations that let headsets charge five times faster then existing products. All these advances are delivered in an architecture that allows the end consumers to pay less for better quality and higher performing headsets.
With the BCM20740, Broadcom adds enhanced noise suppression capabilities that can provide almost 40% more background noise reduction compared with existing noise cancellation. The Broadcom SmartAudio upgrades include dynamic wind noise suppression and near-end speech enhancement algorithms (such as dynamic compression and spectral shaping) that overcome the most challenging and annoying audio interferers. The BCM20740 family combats this interference by utilizing innovative algorithmic techniques in both single and dual mic configurations to identify and detect wind in real time and then applies high speed suppression to deliver a clearer, more enjoyable audio experience.
In addition, as new headsets adopt increasingly sophisticated features, existing user interfaces that lack displays and are limited to using blinking LEDs to convey status information undermine the user's ability to take full advantage of these advancements. Headset pairing, battery life, muting and multipoint status can now be easily conveyed via an integrated voice prompt decoder, allowing users to hear multi-language voice prompts when they use their headsets both in basic and advance modes.
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