---
title: AST Completes Singapore's First High-End FC-BGA Substrate Facility to Meet Growing AI Chip Demand
url: https://www.broadcom.com/company/news/articles/ai-infrastructure/ast-completes-singapores-first-high-end-fc-bga-substrate-facility
description: Advanced Substrate Technologies (AST) today announced the official opening of its new manufacturing facility in Singapore. AST is a joint venture between TOPPAN Holdings Inc. and Broadcom Inc.
---

# AST Completes Singapore's First High-End FC-BGA Substrate Facility to Meet Growing AI Chip Demand

Advanced Substrate Technologies (AST) today announced the official opening of its new manufacturing facility in Singapore, the first in the country capable of producing high-end Flip Chip Ball Grid Array (FC-BGA) substrates, and the TOPPAN Group’s first such facility outside Japan. The milestone comes as demand for advanced substrate capacity, a persistent bottleneck for AI, networking, and next-generation computing chips, continues to outpace global supply. AST is a joint venture between TOPPAN Holdings Inc. and Broadcom Inc.  [Read the full Press Release here](https://www.broadcom.com/company/news/releases/ast-broadcom-toppan-open-substrate-facility).

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