Converged Cable Access Platform/CCAP

Converged Cable Access Platform (CCAP) allows cable operators to lower operating costs by using a single platform for offering traditional video and broadband services to the consumer. Broadcom’s high integration of its CCAP DOCSIS 3.1 PHY and MAC-layer chips allows dense CCAP equipment for hub or head-end deployment helping to maximize utilization of available floor space while minimizing power consumption. Unlike competing solutions, Broadcom’s PHY chips are single chip solutions that offer complete synthesis and capture of the downstream and upstream RF plant without requiring external memory or analog components.

DOCSIS 3.0 CMC PHY

Broadcom's DOCSIS 3.0 CMC PHY-Layer chips integrate all required analog-to-digital and digital-to-analog components enabling economical CMC equipment for use in cable networks.

DOCSIS 3.1 RMD MAC

Broadcom's DOCSIS 3.1 RMD MAC-Layer chip supports full line rate operation at small packet sizes for both upstream and downstream directions enabling high performance RMD equipment for use in cable networks.

DOCSIS 3.1 CCAP Upstream MAC

Broadcom's DOCSIS 3.1 CCAP Upstream MAC-Layer chip supports full line rate operation at small packet sizes enabling dense CCAP equipment for use in cable networks.

DOCSIS 3.0 CMC MAC

Broadcom's DOCSIS 3.0 CMC MAC-Layer chip supports both upstream and downstream directions enabling high performance and economical CMC equipment for use in cable networks.

DOCSIS 3.1 PHY

Broadcom's DOCSIS 3.1 PHY-Layer chips integrate all required analog-to-digital and digital-to-analog components enabling high port density CCAP, RMD and RPD equipment for use in cable networks.