Optical Transmit and Receive Subassemblies
The Broadcom in-house InP and Silica-on Silicon technology platforms and diverse toolbox of device elements enable the efficient design and the scalable high volume fabrication for a broad variety of optical ASICs. Whether by single chip (monolithic) integration or by multi-chip (hybrid) assemblies, Broadcom has achieved high levels of integration using both InP and SoS together with our highly automated, sub-micron precision assembly platforms. The level of integration enables us to provide solutions that have significantly smaller size, higher reliability and lower power consumption compared to traditional discrete components.
Our current product offering includes 4x25G TOSA/ ROSAs for 100G-LR4 and CWDM 4 applications, 4x10G TOSA/ROSAs for the 40G-LR4 LAN/data center market, and planar TOSAs up to10Gb/s.
With class-leading electro-optic performance and exceptionally low power consumption, Broadcom 10G and 2.5G TOSAs are designed for integration into SFP+, XFP, SFP and other transceiver and transponder modules, as well as optical line cards addressing metropolitan network applications. The TOSA portfolio is broadened through the Broadcom Direct Modulated (DML) lasers and cooled electro-absorption (EML) lasers for wide-temperature Time-Division-Multiplexing (TDM), Coarse-wavelength-Division-Multiplexing (CWDM) and Dense WDM (DWDM) applications in Access, Metro and LAN/ data center applications.
The TOSA portfolio is broadened through the Broadcom Direct Modulated (DML) lasers and cooled electro-absorption (EML) lasers for wide-temperature Time-Division-Multiplexing (TDM), Coarse-wavelength-Division-
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