Optical Transmit and Receive Subassemblies
The Broadcom in-house InP and Silica-on Silicon technology platforms and diverse toolbox of device elements enable the efficient design and the scalable high volume fabrication for a broad variety of optical ASICs. Whether by single chip (monolithic) integration or by multi-chip (hybrid) assemblies, Broadcom has achieved high levels of integration using both InP and SoS together with our highly automated, sub-micron precision assembly platforms. The level of integration enables us to provide solutions that have significantly smaller size, higher reliability and lower power consumption compared to traditional discrete components.
Our current product offering includes 4x25G TOSA/ ROSAs for 100G-LR4 applications in compliance with the IEEE-802.bc specifications, 4x10G TOSA/ROSAs for the 40G-LR4 LAN/data center market, 40G and 100G PM-QPSK receivers for the long haul and metro market segments, and narrow linewidth micro-ITLAs (C and L band tunable) for coherent transmission.
With class-leading electro-optic performance and exceptionally low power consumption, Broadcom 10G and 2.5G TOSAs are designed for integration into SFP+, XFP, SFP and other transceiver and transponder modules, as well as optical line cards addressing metropolitan network applications.
The TOSA portfolio is broadened through the Broadcom Direct Modulated (DML) lasers and cooled electro-absorption (EML) lasers for wide-temperature Time-Division-Multiplexing (TDM), Coarse-wavelength-Division-
Broadcom has also introduced a line of next generation PON ONU and OLT solutions in support of the emerging 10G/1G and 10G/10G EPON versions compliant with IEEE 802.3av, as well as 10G/2.5G XG-PON1 versions compliant with ITU G.987.
Modify Your Search
Select multiple product lines by holding down the CTRL key and clicking on your desired selection.