Optical Transmit and Receive Subassemblies

The Broadcom in-house InP and Silica-on Silicon technology platforms and diverse toolbox of device elements enable the efficient design and the scalable high volume fabrication for a broad variety of optical ASICs. Whether by single chip (monolithic) integration or by multi-chip (hybrid) assemblies, Broadcom has achieved high levels of integration using both InP and SoS together with our highly automated, sub-micron precision assembly platforms. The level of integration enables us to provide solutions that have significantly smaller size, higher reliability and lower power consumption compared to traditional discrete components.

Our current product offering includes 4x25G TOSA/ ROSAs for 100G-LR4 applications in compliance with the IEEE-802.bc specifications, 4x10G TOSA/ROSAs for the 40G-LR4 LAN/data center market, 40G and 100G PM-QPSK receivers for the long haul and metro market segments, and narrow linewidth micro-ITLAs (C and L band tunable) for coherent transmission. 

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