HSMQ-C191-T0000 High Performance ChipLED

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This chip type LED utilize InGaN material technology. The AlInGaP material capable of producing high light output over a wide range of drive currents.

The package is binned by color and intensity.

This chipLED come in top emitting package. In order to faciliate pick and place operation, this chipLEDs are shipped in tape and reel, with 4000 units per reel.

This package is compatible with IR soldering process.


• LED with InGaN die
• Surface mount device with 0603 footprint
• Compatible with reflow soldering
• Tape in 8mm carrier tape on a 7 inch diameter reel


• Backlighting
• Indicator

Lifecycle Status


Substance Compliance

  • RoHS6
    Fully Compliant
Specification Value
Lifecycle Active
Distrib. Inventory Yes
Dimension Lxwxh In Mm 1.6 x 0.8 x 0.6
Intensity Bin Selection Open
RoHS6 Compliant Y
Led Chip Type InGaN
Minimum Luminous Intensity (mcd) 285.0
Mounting Direction Top
Mounting Method Surface Mount
Number Of Colors Single
Package ChipLED 0603
ROHS5_NonLeadFree Y
Test Current (mA) 20.0
Typical Dominant Wavelength (nm) 527
Viewing Angle (degree) 140°
Application Note4 i
Design Guide1 i