Surface Mount ChipLEDs
This chip LED is designed in an industry standard package for ease of handling and use.
The HSMS-C190 has the industry standard 1.6 x 0.8 mm footprint, its low 0.8 mm profile and wide viewing angle make this LED exceptional for backlighting applications.
The package is compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.
- Small Size
- Industry Standard Footprint
- Compatible with IR Solder
- Diffused Optics
- Operating Temperature Range of -40OC to 85OC
- Right Angle Package Available
- Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels
|Dimension Lxwxh In Mm||1.6 x 0.8 x 0.8|
|Intensity Bin Selection||Open|
|Led Chip Type||GaP|
|Minimum Luminous Intensity (mcd)||2.5|
|Peak Output Current Min Uom||2a|
|Mounting Method||Surface Mount|
|Number Of Colors||Single|
|Operating Temperature Range||-40°C to +85°C|
|Package||Top Mount Low Profile C190|
|Test Current (mA)||20.0|
|Typical Dominant Wavelength (nm)||626|
|Typical Luminous Intensity (mcd)||10|
|Viewing Angle (degree)||170°|