HSMW-C191-U0000 High Performance ChipLED

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This chip-type LED utilizes AlInGaP material technology capable of producing high-light output over a wide range of drive currents.

The package is binned by color and intensity.

This chipLED comes in a top-emitting package. In order to faciliate pick-and-place operation, the chipLEDs are shipped in tape and reel, with 4000 units per reel.

This package is compatible with IR soldering processes.


• LED with InGaN die
• Small size
• Industry standard footprint
• Diffused optics
• Compatible with reflow soldering
• Available in 8mm tape 7 inch diameter reel


• LCD backlighting
• Front panel indicator
• Push button backlighting
• Symbol indicator

Lifecycle Status


Substance Compliance

  • RoHS6
    Fully Compliant
Specification Value
Lifecycle Active
Distrib. Inventory Yes
Dimension Lxwxh In Mm 1.6 x 0.8 x 0.6
Intensity Bin Selection Open
RoHS6 Compliant Y
Led Chip Type InGaN
Minimum Luminous Intensity (mcd) 450.0
Mounting Direction Top
Mounting Method Surface Mount
Number Of Colors Single
Package ChipLED 0603
ROHS5_NonLeadFree Y
Test Current (mA) 20.0
Typical Dominant Wavelength (nm) N/A
Typical Luminous Intensity (mcd) N/A
Viewing Angle (degree) 140°

Design Guide1 i