HSMD-C170
Surface Mount ChipLED
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Overview
This chip LED is designed in an industry standard package for ease of handling and use.
The HSMD-C170 has the widely used 2.0 x 1.25 mm footprint.
This package is compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.
Features
- Small Size
- Industry Standard Footprint
- Compatible with IR Solder
- Diffused Optics
- Operating Temperature Range of -40°C to 85°C
- Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels
Applications
- Keypad Backlighting
- Push-Button Backlighting
- LCD Backlighting
- Symbol Backlighting
- Front Panel Indicator
Active
Substance Compliance
-
RoHS6Fully Compliant
Specifications
| Specification | Value |
|---|---|
| Lifecycle | Active |
| Distrib. Inventory | Yes |
| Color Bin Selection | Open |
| Dimension Lxwxh In Mm | 2.0 x 1.25 x 0.8 |
| Intensity Bin Selection | Open |
| RoHS6 Compliant | Y |
| Led Chip Type | GaP |
| Minimum Luminous Intensity (mcd) | 2.5 |
| Peak Output Current Min Uom | 2a |
| Mounting Direction | Top |
| Mounting Method | Surface Mount |
| Number Of Colors | Single |
| Operating Temperature Range | -30°C to +85°C |
| Package | Tape and Reel |
| Test Current (mA) | 20.0 |
| Typical Dominant Wavelength (nm) | 604 |
| Typical Luminous Intensity (mcd) | 8 |
| Viewing Angle (degree) | 170° |