HSMQ-C170-T0000 High Performance ChipLED

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This chip-type LED utilizes InGaN material technology capable of producing high-light output over a wide range of drive currents.

The package is binned by color and intensity.

This chipLED comes in a top-emitting package. In order to faciliate pick and place operation, the chipLEDs are shipped in tape and reel, with 4000 units per reel.

This package is compatible with IR soldering processes.


• LED with InGaN die
• Surface mount device with 0805 footprint
• Compatible with reflow soldering
• Tape in 8mm carrier tape on a 7 inch diameter reel


• LCD backlighting
• Front panel indicator
• Push button backlighting
• Symbol indicator

Lifecycle Status


Substance Compliance

  • RoHS6
    Fully Compliant
Specification Value
Lifecycle Active
Distrib. Inventory Yes
Color Bin Selection Open
Dimension Lxwxh In Mm 2.0 x 1.25 x 0.8
Intensity Bin Selection Open
RoHS6 Compliant Y
Led Chip Type InGaN
Minimum Luminous Intensity (mcd) 285.0
Mounting Direction Top
Mounting Method Surface Mount
Number Of Colors Single
Package ChipLED 0805
Test Current (mA) 20.0
Typical Dominant Wavelength (nm) 527
Viewing Angle (degree) 140°

Design Guide1 i