HSMY-C170

Surface Mount ChipLEDs

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This chip LED is designed in an industry standard package for ease of handling and use.

The HSMY-C170 has the widely used 2.0 x 1.25 mm footprint.

This package is compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.

Features

  • Small Size
  • Industry Standard Footprint
  • Compatible with IR Solder
  • Diffused Optics
  • Operating Temperature Range of -40OC to 85OC
  • Right Angle Package Available
  • Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels

Lifecycle Status

Active

Substance Compliance

  • RoHS6
    Fully Compliant
Specification Value
Lifecycle Active
Distrib. Inventory Yes
Color Bin Selection Open
Dimension Lxwxh In Mm 2.0 x 1.25 x 0.8
Intensity Bin Selection Open
RoHS6 Compliant Y
Led Chip Type GaP
Max Qty of Samples 20
Minimum Luminous Intensity (mcd) 2.5
Peak Output Current Min Uom 2a
Mounting Direction Top
Mounting Method Surface Mount
Number Of Colors Single
Operating Temperature Range -40°C to +85°C
Package Tape and Reel
Test Current (mA) 20.0
Typical Dominant Wavelength (nm) 586
Typical Luminous Intensity (mcd) 8
Viewing Angle (degree) 170°

Application Brief4 i
Application Note3 i
Design Guide1 i
Product Change Notice (PCN)4 i
Reliability Data Sheet1 i