HSMF-C112

0303 Tri-Color Top Mount ChipLED

Currently Viewing:

HSMF-C112 is a 4-pins tricolor RGB surface-mount chipLED. This chipLED is available in a very small package footrpint of 0.69 mm x 0.69 mm. The small package footprint and low package height of 0.5 mm make this chipLED an ideal solution for applications that have constraints in space and head room, such as wearables and handheld portable devices. Its small form factor enables flexible board design and allows the chipLED to be assembled in a closer pitch. This chipLED offers industry-leading light output performance by utilizing efficient and high brightness AlInGaP and InGaN LED materials. This chipLED is compatible with reflow soldering processes. For easy pick-and-place, the parts are packed in tape and reel. Every reel is shipped from a single intensity and color bin for better uniformity control.

Features

• LED with AlInGaP red, InGaN green and blue
• Compatible with reflow soldering
• Tape in 8 mm carrier tape on a 7-in. diameter reel

 

Applications

• Backlighting
• Indicator

Lifecycle Status

Active

Substance Compliance

  • RoHS6
    Fully Compliant
Specification Value
Lifecycle Active
Distrib. Inventory Yes
Color Red, Green & Blue
Color Bin Selection Open
Dimension Lxwxh In Mm 0.69 x 0.69 x 0.50
Intensity Bin Selection Open
Lead Bend Configuration Right Angle
RoHS6 Compliant Y
Mounting Method Surface Mount
Number Of Colors Tricolor
Package Tape and Reel
Typical Dominant Wavelength (nm) 622 (Red), 527 (Green), 468 (Blue)
Viewing Angle (degree) 130° & 150° & 150°
Data Sheet1 i
Design Guide1 i