Tri-color Surface Top Mount chipLED

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The HSMF-C118 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 3000 units per reel. The package is compatible with IR soldering and binned by both color and intensity.


  • Common anode
  • Small 3.2 x 2.7 x 1.1 mm package
  • Diffused optics
  • Red/Green/Blue color combination
  • Available in 8 mm tape on 7 inch (178 mm) diameter reels
  • High brightness using AlInGaP and InGaN die technology
  • Compatible with reflow soldering


  • Backlighting
  • Status indicator
  • Front panel indicator
  • Office automation, home appliances, industrial equipment

Lifecycle Status


Substance Compliance

  • RoHS6
    Fully Compliant
Specification Value
Lifecycle Active
Distrib. Inventory Yes
Color Red, Green & Blue
Color Bin Selection Open
Dimension Lxwxh In Mm 3.2 x 2.7 x 1.1
Intensity Bin Selection Open
RoHS6 Compliant Y
Led Chip Type GaP
Lens Type Flat Top, Diffused, Untinted
Peak Output Current Min (A) 1999
Minimum Luminous Intensity (mcd) 2.5
Peak Output Current Min Uom 2a
Mounting Direction Top
Mounting Method Surface Mount
Number Of Colors Tricolor
Package Tri-Color
ROHS5_NonLeadFree Y
Test Current (mA) 20.0
Typical Forward Voltage In V 3.6
Typical Dominant Wavelength (nm) 626 & 525 & 471
Typical Luminous Intensity (lm) 90 & 120 & 140
Viewing Angle (degree) 140° & 145° & 145°
Peak Output Current Min (A) 1999 2a
Application Brief2 i
Application Note3 i
Design Guide1 i
Product Change Notice (PCN)5 i
Reliability Data Sheet1 i