Subminiature LED lamp

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Flat top package
The HLMP-P505 flat top lamp adopts a lens with chamfered tips of deep color and non-diffuse light, realizing the wide range of irradiation patterns required for backlighting.

Lead configuration
Enclose the LED chip in a shaft lead frame to form a molded epoxy lamp package. For details, please see the standard surface mount and through hole bend option of the subminiature LED lamp datasheet.



  • Ultra small flat top package​
  • Ideal for backlight and light conductor applications
  • Ideal for narrow spaces
  • Axis lead
  • Yoke lead, 12 mm tape / 7 inch diameter reel, 1500 parts per reel

Lifecycle Status


Substance Compliance

  • RoHS6
    Fully Compliant
Specification Value
Lifecycle Active
Distrib. Inventory Yes
Color Green
Color Bin Selection Open
Dimension Lxwxh In Mm 2.2 x 2.1 x 2.2
Intensity Bin Selection Open
Lead Bend Configuration Yoke Bend
RoHS6 Compliant Y
Led Chip Type GaP
Minimum Luminous Intensity (mcd) 1.6
Peak Output Current Min Uom 2a
Mounting Direction Reverse
Mounting Method Surface Mount
Number Of Colors Single
Package Flat Top Subminiature
Test Current (mA) 10.0
Typical Dominant Wavelength (nm) 569
Typical Luminous Intensity (lm) 6.3
Viewing Angle (degree) 125°
Application Brief3 i
Application Note4 i
Data Sheet2 i
Product Change Notice (PCN)2 i
Reliability Data Sheet1 i