HLMP-QM00-S0000

HLMP-QM00-N0000 Subminiature InGaN Green LED Lamps

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Overview

HLMP-PC00

Flat Top Package
The HLMP-QM00 flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.

Lead Configurations
All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more infor-mation refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps data sheet.

Features

  • Subminiature Dome Package
    Non diffussed dome for high brightness
  • Color: 525 nm Green
  • Ideal for Space Limited Applications
  • Axial Leads
  • Available with Lead Configurations for Surface Mount and Through Hole PC Board Mounting

Applications

  • Consumer
  • Industrial
  • Computer Peripheral
  • Communication

Active

Substance Compliance

  • RoHS6
    Fully Compliant

Specifications

Specification Value
Lifecycle Active
Distrib. Inventory Yes
Color Green
Color Bin Selection Open
Dimension Lxwxh In Mm 2.2 x 2.1 x 2.9
Intensity Bin Selection Open
RoHS6 Compliant Y
Led Chip Type InGaN
Lens Type Domed-clear-non_tinted
Minimum Luminous Intensity (mcd) 160.0
Peak Output Current Min Uom 2a
Mounting Method Surface Mount
Number Of Colors Single
Operating Temperature Range -40°C to +85°C
Package Domed Subminiature
Test Current (mA) 20.0
Typical Forward Voltage In V 3.7 V @ 20mA
Typical Dominant Wavelength (nm) 525
Typical Luminous Intensity (mcd) 690
Viewing Angle (degree) 20

Documentation

Application Note1 i
Data Sheet2 i
Product Change Notice (PCN)2 i
Reliability Data Sheet0 i