V11-024-480035-0B - Assembly and Test related change
To qualify alternate assembly and test sources
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Language: English
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05/14/2012 |
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V11-024-480035-0A - Assembly and Test related change
To qualify alternate assembly and test sources
File Size: 195 KB
Language: English
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11/03/2011 |
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Qualifying New Contract Manufacturers
Qualifying New Contract Manufacturers
File Size: 348 KB
Language: English
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03/01/2009 |
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CCN021402AT1 - Transfer of semiconductor wafer fabrication
Transfer of semiconductor wafer fabrication from locations in Santa Clara and Newark, California to World Class facility in Fort Collins, Colorado
File Size: 17 KB
Language: English
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10/27/2005 |
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PCN: A05-025-480035-0A, Oct. 2005
Silicon wafer substrate diameter used for fabricating these diodes will change from three inch to six inch. Additionally, all the equipments and processes will different from the existing three-inch wafer fabrication.
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10/03/2005 |
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PCN: A05-010-480035-0A, Mar. 2005
Qualification of an additional contract manufacturer for Wireless Semiconductor Divisionÿs SOT-363, SOT-343 and SOT-323 packaged products.
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Language: English
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03/17/2005 |
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PCN: A04-001-480035-0A, Mar. 2004
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Language: English
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03/22/2004 |
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PCN: A03-003-480035-1A, Sept. 2003
Avago Technologies will be qualifying a new subcontractor to manufacture these diodes and the die-attach process will be changed from current silver-epoxy to eutectic bonding.
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Language: English
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09/29/2003 |
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Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002
All Avago Technologies Surface Mount LEDs as stated in the attachment will have humidity indicator card and JEDEC moisture sensitive label on the moisture barrier bag. Please check full PCN document for more details and affected parts.
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Language: English
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09/01/2002 |
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Recall Notification for SOT-323 (SC-70 3-Lead)
Recall Notification for SOT-323 (SC-70 3-Lead)
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Language: English
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04/24/2001 |
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022500TC1: Customer Change Notification
022500TC1: AT-3xx32, AT-3xx43, AT-3xx63, AT-4xx32, ATF-xxx43, ATF-xxx63, HBAT-540a, HBAT-540x, HBFP-04xx, HSMP-38xa, HSMP-38xx, HSMP-48xa, HSMP-48xx, HSMS-270a, HSMS-270x, HSMS-28xa, HSMS-28xx, HSMS-810x, HSMS-820x, IAM-91563, INA-xx063, MGA-72543, MGA-xx
File Size: 18 KB
Language: English
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05/31/2000 |
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CCN042000TC1 - SOT-323 (SC70 3 lead) Surface Mount Schottky Barrier and PIN diodes
A subcontractor has been qualified as an alternate manufacturer of the above products. While Avago Technologies will continue to manufacture these devices internally, there may be instances where the same part numbers will be manufactured at the subcontractor for supplemental capacity. Customers may receive parts from either manufacturing facility. Additional information on the subcontractor is shown in Appendix 1.
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Language: English
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04/19/2000 |
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CCN#9904A-REVISION B: Customer Change Notice
CCN#9904A-REVISION B: 55 SOT-23, SOT-143, SOT-323, SOT-343, SOT-363, and package 36, 84, and 86 products affected. See Full Alert for specific part numbers.
File Size: 197 KB
Language: English
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07/31/1999 |
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CCN:9710a - HSMS, HSMP #L30, #L31
SOT-23 and SOT-143 Diodes will no longer use option "#L30" to denote bulk packaging, and will no longer use
option "#L31" to denote tape-and-reel packaging. These options will be replaced by "-BLK" and "-TR1",
respectively. The marking on the diodes themselves will not change.
File Size: 10 KB
Language: English
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10/09/1997 |
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CCN:062597dg1- AT, INA, MSA, HSMS, HSMP Mfg. location change
The following manufacturing processes will be transferred from the HP Malaysia manufacturing site to a Malaysian subcontractor. The subcontractor will be using HP equipment and procedures: Deflash, Lead Forming, Post Mold Cure, Marking & Curing, Dejunk/Dedambar, Singulation. This change will ensure optimum utilization of manufacturing capacity.
File Size: 130 KB
Language: English
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06/24/1997 |
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