HSMP-381C

Low distortion PIN attenuator diode

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Overview

Overview
Specifications
Documentation

Overview

The HSMP-381C / HSMP-381x family of PIN diodes are the ideal solution for low distortion pin diode attenuator applications.

Features

Ct=0.35pF
Rs@100mA=2.5ohms
Tau=1800nsec
Fc=88kHz

Lifecycle Status

Active

Substance Compliance

RoHS6

Fully Compliant

Specifications

Specification	Value
Lifecycle	Active
Bkdwn Vo In V	100.0
Carrier Life In Nsec (ns)	1500
Connection	Series Pair
RoHS6 Compliant	Y
Max Cap In Pf	0.35
Distrib. Inventory	Yes
Peak Output Current Min Uom	MSL 1
Mounting Direction	Top
Mounting Method	Solder Reflow
Pin Count	3.0
Product Type	Low Distortion Attenuator
Lifetime Ns	1500.0
Trr Ns	300.0
Ct (pF)	0.27
RS (ohm)	3
Trr (nS)	300
VBR (V)	100
Vbr V	100.0
Ct Pf	0.27
Series Res In Ohms	3.0
Configuration	Series Pair
Package	SOT-323

Documentation

Application Brief1

Title	Date	Type	Alert
Surface Mount Schottky PIN Diode Product Family Overview File Size: 57 KB Language: English	08/01/2006	pdf	Create

Application Note8

Title	Date	Type	Alert
AN 9571: Broading the Shunt PIN Diode SPDT Switch Broadbanding the Shunt PIN Diode SPDT Switch File Size: 114 KB Language: English	08/15/2010	pdf	Create
29533 Reducing the Insertion Loss of a Shunt PIN Diode File Size: 105 KB Language: English	08/13/2010	pdf	Create
AN 9572: Reducing the Insertion Loss a Shunt PIN Diode Reducing the Insertion Loss of a Shunt PIN Diode File Size: 105 KB Language: English	08/13/2010	pdf	Create
AN 1124: Linear Models for Diode Surface Mount Packages File Size: 141 KB Language: English	07/20/2010	pdf	Create
AN A004R: Electrostatic Discharge mage Control File Size: 396 KB Language: English	07/13/2010	pdf	Create
AN 1048: Cost Surface Mount PIN Diode Pi Attenuator File Size: 146 KB Language: English	07/12/2010	pdf	Create
AN 922: Applications PIN Diodes File Size: 1622 KB Language: English	07/12/2010	pdf	Create
AN A006: Mounting Considerations for Microwave Semiconductors Mounting Considerations for Packaged Microwave Semiconductors File Size: 87 KB Language: English	07/21/2009	pdf	Create

Data Sheet1

Title	Date	Type	Alert
HSMP-381x,HSMP-481x Surface Mount RF PIN Low Distortion Attenuator Diodes HSMP-381x, 481x Surface Mount RF PIN Low Distortion Attenuator Diodes Data Sheet File Size: 125 KB Language: English	12/21/2009	pdf	Create

Obsolescence Notice0

Product Change Notice (PCN)15

Title	Date	Type	Alert
V11-024-480035-0B - Assembly and Test related change To qualify alternate assembly and test sources File Size: 51 KB Language: English	05/14/2012	pdf	Create
V11-024-480035-0A - Assembly and Test related change To qualify alternate assembly and test sources File Size: 195 KB Language: English	11/03/2011	pdf	Create
Qualifying New Contract Manufacturers Qualifying New Contract Manufacturers File Size: 348 KB Language: English	03/01/2009	pdf	Create
CCN021402AT1 - Transfer of semiconductor wafer fabrication Transfer of semiconductor wafer fabrication from locations in Santa Clara and Newark, California to World Class facility in Fort Collins, Colorado File Size: 17 KB Language: English	10/27/2005	pdf	Create
PCN: A05-025-480035-0A, Oct. 2005 Silicon wafer substrate diameter used for fabricating these diodes will change from three inch to six inch. Additionally, all the equipments and processes will different from the existing three-inch wafer fabrication. File Size: 21 KB Language: English	10/03/2005	pdf	Create
PCN: A05-010-480035-0A, Mar. 2005 Qualification of an additional contract manufacturer for Wireless Semiconductor DivisionÃÂ¿s SOT-363, SOT-343 and SOT-323 packaged products. File Size: 21 KB Language: English	03/17/2005	pdf	Create
PCN: A04-001-480035-0A, Mar. 2004 File Size: 153 KB Language: English	03/22/2004	pdf	Create
PCN: A03-003-480035-1A, Sept. 2003 Avago Technologies will be qualifying a new subcontractor to manufacture these diodes and the die-attach process will be changed from current silver-epoxy to eutectic bonding. File Size: 15 KB Language: English	09/29/2003	pdf	Create
Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002 All Avago Technologies Surface Mount LEDs as stated in the attachment will have humidity indicator card and JEDEC moisture sensitive label on the moisture barrier bag. Please check full PCN document for more details and affected parts. File Size: 88 KB Language: English	09/01/2002	pdf	Create
Recall Notification for SOT-323 (SC-70 3-Lead) Recall Notification for SOT-323 (SC-70 3-Lead) File Size: 23 KB Language: English	04/24/2001	pdf	Create
022500TC1: Customer Change Notification 022500TC1: AT-3xx32, AT-3xx43, AT-3xx63, AT-4xx32, ATF-xxx43, ATF-xxx63, HBAT-540a, HBAT-540x, HBFP-04xx, HSMP-38xa, HSMP-38xx, HSMP-48xa, HSMP-48xx, HSMS-270a, HSMS-270x, HSMS-28xa, HSMS-28xx, HSMS-810x, HSMS-820x, IAM-91563, INA-xx063, MGA-72543, MGA-xx File Size: 18 KB Language: English	05/31/2000	pdf	Create
CCN042000TC1 - SOT-323 (SC70 3 lead) Surface Mount Schottky Barrier and PIN diodes A subcontractor has been qualified as an alternate manufacturer of the above products. While Avago Technologies will continue to manufacture these devices internally, there may be instances where the same part numbers will be manufactured at the subcontractor for supplemental capacity. Customers may receive parts from either manufacturing facility. Additional information on the subcontractor is shown in Appendix 1. File Size: 41 KB Language: English	04/19/2000	pdf	Create
CCN#9904A-REVISION B: Customer Change Notice CCN#9904A-REVISION B: 55 SOT-23, SOT-143, SOT-323, SOT-343, SOT-363, and package 36, 84, and 86 products affected. See Full Alert for specific part numbers. File Size: 197 KB Language: English	07/31/1999	pdf	Create
CCN:9710a - HSMS, HSMP #L30, #L31 SOT-23 and SOT-143 Diodes will no longer use option "#L30" to denote bulk packaging, and will no longer use option "#L31" to denote tape-and-reel packaging. These options will be replaced by "-BLK" and "-TR1", respectively. The marking on the diodes themselves will not change. File Size: 10 KB Language: English	10/09/1997	pdf	Create
CCN:062597dg1- AT, INA, MSA, HSMS, HSMP Mfg. location change The following manufacturing processes will be transferred from the HP Malaysia manufacturing site to a Malaysian subcontractor. The subcontractor will be using HP equipment and procedures: Deflash, Lead Forming, Post Mold Cure, Marking & Curing, Dejunk/Dedambar, Singulation. This change will ensure optimum utilization of manufacturing capacity. File Size: 130 KB Language: English	06/24/1997	pdf	Create

Reliability Data Sheet1

Title	Date	Type	Alert
HSMP-38xx HSMP-48xx Surface Mount PIN Diodes File Size: 39 KB Language: English	06/21/2012	pdf	Create

Spice Model1

Amplifiers, Filters, and RF Components

SoCs and Processors

HSMP-381C

Low distortion PIN attenuator diode

Overview

Features

Lifecycle Status

Substance Compliance

Specifications

Documentation

Title	Date	Type	Alert
HSMP-381x_APLAC While models in this library reflect close similarity to device performance, simulation is only a supplement to lab evaluation. Model performance in general will reflect typical specs for a device, but some aspects of performance may not be modeled fully. Care has been taken in their preparation, however, we cannot be responsible for correct application on any and all computer systems. Avago Technologies reserves the right to improve these models without prior notice. Refer to the datasheet for guaranteed performance and design guidelines. File Size: 1 KB Language: English	02/25/2000	etc	Create