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Overview
Features
The HSMS-281x family are General purpose, low flicker (1/f) noise schottky diodes.VBR=20 V, CT=1.2pF, RD=15 Ohms, Vf @ 1 mA=410 mV
Lifecycle Status
Obsolete
Replacement Part
Substance Compliance
-
RoHS6Fully Compliant 
Specifications
| Specification | Value |
|---|---|
| Lifecycle | Obsolete |
| Distrib. Inventory | No |
| Configuration | Ring Quad |
| Ct Pf | 1.2 |
| RoHS6 Compliant | Y |
| Package | SOT-143 |
| Vbr V | 20.0 |
| Vf Mv | 400.0 |
| Series Res In Ohms | 15.0 |
Documentation
Application Note15
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Application Note
Gives more specific details on using a component in a specific application.
| Title | Date | Type | Alert |
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AN 956-5: Dynamic Range Extension Schottky Detectors
File Size: 112 KB
Language: English
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08/15/2010 | Create | |
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AN 988: All Schottky Diodes are Zero Bias Detectors
File Size: 769 KB
Language: English
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08/13/2010 | Create | |
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AN 986: Square Law Linear Detection
File Size: 663 KB
Language: English
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08/13/2010 | Create | |
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AN 963: Matching Techniques for Mixers Detectors
Application Note
File Size: 1019 KB
Language: English
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08/13/2010 | Create | |
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AN 987: Is Bias Current Necessary
File Size: 115 KB
Language: English
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08/13/2010 | Create | |
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AN 1088: Designing the Virtual Battery
Application Note
File Size: 1083 KB
Language: English
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07/21/2010 | Create | |
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AN 1124: Linear Models for Diode Surface Mount Packages
File Size: 141 KB
Language: English
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07/20/2010 | Create | |
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AN 9561: The Criterion for the Tangential Sensitivity Measurement
File Size: 123 KB
Language: English
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07/18/2010 | Create | |
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AN A004R: Electrostatic Discharge mage Control
File Size: 396 KB
Language: English
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07/13/2010 | Create | |
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AN 956-3 Flicker Noise Schottky Diodes
File Size: 160 KB
Language: English
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07/12/2010 | Create | |
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AN 956-6: Temperature Dependence Schottky Detector Voltage Sensitivity
AN 956-6: Temperature Dependence of Schottky Detector Voltage Sensitivity
File Size: 512 KB
Language: English
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06/27/2010 | Create | |
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AN 9441: Microwave Transistor Bias Considerations
AN 944-1: Microwave Transistor Bias Considerations
File Size: 1447 KB
Language: English
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05/10/2010 | Create | |
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AN A006: Mounting Considerations for Microwave Semiconductors
Mounting Considerations for Packaged Microwave Semiconductors
File Size: 87 KB
Language: English
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07/21/2009 | Create | |
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AN 1156: Diode Detector Simulation EEs ADS Softward
File Size: 162 KB
Language: English
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02/21/2007 | Create | |
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AN 923: Schottky Barrier Video Detectors
Application Note
File Size: 190 KB
Language: English
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12/08/2006 | Create |
Data Sheet1
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Data Sheet
Provides information on device features, signal descriptions, electrical characteristics, packaging, and pinout information.
| Title | Date | Type | Alert |
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HSMS-281x, Surface Mount RF Schottky Barrier Diodes
File Size: 433 KB
Language: English
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05/28/2009 | Create |
Obsolescence Notice1
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Obsolescence Notice
| Title | Date | Type | Alert |
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Product Obsolescence Notice OBS120117WSD3, Dec. 2017
Last time buys will be offered through June 1, 2018. Orders will be acceptable on a non-cancelable, non-returnable basis only.
File Size: 502 KB
Language: English
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12/01/2017 | Create |
Product Change Notice (PCN)17
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Product Change Notice (PCN)
Notices about a change to a product or its manufacturing process or lifecycle status.
| Title | Date | Type | Alert |
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V11-024-480035-0B - Assembly and Test related change
To qualify alternate assembly and test sources
File Size: 51 KB
Language: English
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05/14/2012 | Create | |
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V11-024-480035-0A - Assembly and Test related change
To qualify alternate assembly and test sources
File Size: 195 KB
Language: English
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11/03/2011 | Create | |
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Qualifying New Contract Manufacturers
Qualifying New Contract Manufacturers
File Size: 348 KB
Language: English
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03/01/2009 | Create | |
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CCN082701TC1 - Si wafer substrate will change from 3" to 4"
CCN082701TC1 - Si wafer substrate will change from 3" to 4"
File Size: 22 KB
Language: English
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10/27/2005 | Create | |
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CCN021402AT1 - Transfer of semiconductor wafer fabrication
Transfer of semiconductor wafer fabrication from locations in Santa Clara and Newark, California to World Class facility in Fort Collins, Colorado
File Size: 17 KB
Language: English
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10/27/2005 | Create | |
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PCN: A03-003-480035-1A, Sept. 2003
Avago Technologies will be qualifying a new subcontractor to manufacture these diodes and the die-attach process will be changed from current silver-epoxy to eutectic bonding.
File Size: 15 KB
Language: English
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09/29/2003 | Create | |
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PCN: A03-001-480035-1A, Jan 2003
File Size: 15 KB
Language: English
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01/06/2003 | Create | |
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Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002
All Avago Technologies Surface Mount LEDs as stated in the attachment will have humidity indicator card and JEDEC moisture sensitive label on the moisture barrier bag. Please check full PCN document for more details and affected parts.
File Size: 88 KB
Language: English
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09/01/2002 | Create | |
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CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab
Consolidate silicon epi processing into higher capacity facility with newer equipment for operational, facility and maintenance efficiency.
File Size: 24 KB
Language: English
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08/23/2001 | Create | |
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Recall Notification for SOT-323 (SC-70 3-Lead)
Recall Notification for SOT-323 (SC-70 3-Lead)
File Size: 23 KB
Language: English
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04/24/2001 | Create | |
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CCN082100TC1 - Transistors, Diodes, INA's and MSA products on SOT-23 and SOT-143
File Size: 40 KB
Language: English
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08/20/2000 | Create | |
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022500TC1: Customer Change Notification
022500TC1: AT-3xx32, AT-3xx43, AT-3xx63, AT-4xx32, ATF-xxx43, ATF-xxx63, HBAT-540a, HBAT-540x, HBFP-04xx, HSMP-38xa, HSMP-38xx, HSMP-48xa, HSMP-48xx, HSMS-270a, HSMS-270x, HSMS-28xa, HSMS-28xx, HSMS-810x, HSMS-820x, IAM-91563, INA-xx063, MGA-72543, MGA-xx
File Size: 18 KB
Language: English
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05/31/2000 | Create | |
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CCN#9904A-REVISION B: Customer Change Notice
CCN#9904A-REVISION B: 55 SOT-23, SOT-143, SOT-323, SOT-343, SOT-363, and package 36, 84, and 86 products affected. See Full Alert for specific part numbers.
File Size: 197 KB
Language: English
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07/31/1999 | Create | |
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CCN:9905a - HSMS-280x and -281x subcon
A sub-contractor manufacturing company will be an alternate manufacturer of the above products. While Avago will continue to manufacture these products internally, there will be instances where the same part numbers will be manufactured in the sub-contractor for supplemental capacity. Customers will receive similar products from both manufacturers. Appropriate qualifications have been performed to ensure no change in product quality. Completed reliability qualification tests are shown in Appendix 1.
File Size: 47 KB
Language: English
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04/30/1999 | Create | |
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CCN:9811a - HSMS, HBAT laser marking
This change is being made to increase production capacity and improve customer deliveries. In the line of
zero defects, the conversion to laser marking will present better process and quality controls within
manufacturing. The SOT-323 and SOT-363 Surface Mount RF/mW Schottky and PIN Diodes are already being
laser marked. This change together with the future conversion of SOT-23 and 143 PIN diodes and other
products to laser mark will further standardize the whole line of Hewlett-Packard Surface Mount products.
File Size: 36 KB
Language: English
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10/31/1998 | Create | |
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CCN:9710a - HSMS, HSMP #L30, #L31
SOT-23 and SOT-143 Diodes will no longer use option "#L30" to denote bulk packaging, and will no longer use
option "#L31" to denote tape-and-reel packaging. These options will be replaced by "-BLK" and "-TR1",
respectively. The marking on the diodes themselves will not change.
File Size: 10 KB
Language: English
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10/09/1997 | Create | |
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CCN:062597dg1- AT, INA, MSA, HSMS, HSMP Mfg. location change
The following manufacturing processes will be transferred from the HP Malaysia manufacturing site to a Malaysian subcontractor. The subcontractor will be using HP equipment and procedures: Deflash, Lead Forming, Post Mold Cure, Marking & Curing, Dejunk/Dedambar, Singulation. This change will ensure optimum utilization of manufacturing capacity.
File Size: 130 KB
Language: English
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06/24/1997 | Create |
Reliability Data Sheet1
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Reliability Data Sheet
| Title | Date | Type | Alert |
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HBAT-54xx, HSMS-270x, HSMS-280x, HSMS-281x, HSMS-282x, Surface Mount Schottky Diodes Reliability Data Sheet
HBAT-54xx, HSMS-270x, HSMS-280x, HSMS-281x, HSMS-282x
Surface Mount Schottky Diodes
Reliability Data Sheet
File Size: 120 KB
Language: English
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08/01/2007 | Create |
Downloads
If you are looking for older or archived product downloads, please use the documents and downloads search tool.
SPICE Model1
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SPICE Model
The SPICE macro models are available in txt file format. These macro models may be useful in evaluating product performance and checking integrity of circuit designs through SPICE simulation.
| Title | Date | Type | Create |
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HSMS-281x_SPICE
While models in this library reflect close similarity to device performance, simulation is only a supplement to lab evaluation. Model performance in general will reflect typical specs for a device, but some aspects of performance may not be modeled fully. Care has been taken in their preparation, however, we cannot be responsible for correct application on any and all computer systems. Avago Technologies reserves the right to improve these models without prior notice. Refer to the datasheet for guaranteed performance and design guidelines.
File Size: 0 KB
Language: English
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02/25/2000 | etc | Create |