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HSMS-8209

X-band mixer diode

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Overview

Overview
Specifications
Documentation

Overview

SOT 143

Features

HSMS-8xxx is a family of low cost microwave Schottky diodes that are specifically designed for use at X/Ku-bands and are ideal for DBS and VSAT down converter applications.VBR=4 V, CT=0.26 pF, RD=14Ohms, Vf @ 1 mA=350 mV

Active

Substance Compliance

RoHS6

Fully Compliant

Specifications

Specification	Value
Lifecycle	Active
Distrib. Inventory	Yes
Configuration	Crossover Quad
Ct Pf	0.26
RoHS6 Compliant	Y
Package	SOT-143
Vbr V	4.0
Vf Mv	250.0
Series Res In Ohms	14.0

Documentation

Application Note16

Equivalent Circuit1

Obsolescence Notice0

Product Change Notice (PCN)11

Title	Date	Type	Alert
Qualifying New Contract Manufacturers Qualifying New Contract Manufacturers File Size: 348 KB Language: English	03/01/2009	pdf	Create
CCN021402AT1 - Transfer of semiconductor wafer fabrication Transfer of semiconductor wafer fabrication from locations in Santa Clara and Newark, California to World Class facility in Fort Collins, Colorado File Size: 17 KB Language: English	10/27/2005	pdf	Create
PCN: A04-012-480035-0A, Dec. 2004 Silicon wafer substrate diameter used for fabricating these diodes will change from three inch to six inch. Additionally, all the equipments and processes will different from the existing three-inch wafer fabrication. File Size: 16 KB Language: English	12/22/2004	pdf	Create
PCN: A03-003-480035-1A, Sept. 2003 Avago Technologies will be qualifying a new subcontractor to manufacture these diodes and the die-attach process will be changed from current silver-epoxy to eutectic bonding. File Size: 15 KB Language: English	09/29/2003	pdf	Create
PCN: A03-001-480035-1A, Jan 2003 File Size: 15 KB Language: English	01/06/2003	pdf	Create
Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002 All Avago Technologies Surface Mount LEDs as stated in the attachment will have humidity indicator card and JEDEC moisture sensitive label on the moisture barrier bag. Please check full PCN document for more details and affected parts. File Size: 88 KB Language: English	09/01/2002	pdf	Create
CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab Consolidate silicon epi processing into higher capacity facility with newer equipment for operational, facility and maintenance efficiency. File Size: 24 KB Language: English	08/23/2001	pdf	Create
CCN082100TC1 - Transistors, Diodes, INA's and MSA products on SOT-23 and SOT-143 File Size: 40 KB Language: English	08/20/2000	pdf	Create
022500TC1: Customer Change Notification 022500TC1: AT-3xx32, AT-3xx43, AT-3xx63, AT-4xx32, ATF-xxx43, ATF-xxx63, HBAT-540a, HBAT-540x, HBFP-04xx, HSMP-38xa, HSMP-38xx, HSMP-48xa, HSMP-48xx, HSMS-270a, HSMS-270x, HSMS-28xa, HSMS-28xx, HSMS-810x, HSMS-820x, IAM-91563, INA-xx063, MGA-72543, MGA-xx File Size: 18 KB Language: English	05/31/2000	pdf	Create
CCN#9904A-REVISION B: Customer Change Notice CCN#9904A-REVISION B: 55 SOT-23, SOT-143, SOT-323, SOT-343, SOT-363, and package 36, 84, and 86 products affected. See Full Alert for specific part numbers. File Size: 197 KB Language: English	07/31/1999	pdf	Create
CCN:9811a - HSMS, HBAT laser marking This change is being made to increase production capacity and improve customer deliveries. In the line of zero defects, the conversion to laser marking will present better process and quality controls within manufacturing. The SOT-323 and SOT-363 Surface Mount RF/mW Schottky and PIN Diodes are already being laser marked. This change together with the future conversion of SOT-23 and 143 PIN diodes and other products to laser mark will further standardize the whole line of Hewlett-Packard Surface Mount products. File Size: 36 KB Language: English	10/31/1998	pdf	Create

Reliability Data Sheet1