--- title: "AI Infrastructure: Open, scalable and power-efficient technologies for AI clusters" url: https://www.broadcom.com/solutions/ai-solutions/ai-infrastructure description: Learn how Broadcom’s wired connectivity, optical technology and XPUs enable next-gen AI infrastructure. --- # AI Infrastructure: Open, scalable and power-efficient technologies for AI clusters ## Scaling AI Infrastructure Foundational technologies for AI clusters that deliver new levels of performance, scale and efficiency. Discover Broadcom’s next-generation AI networking, connectivity solutions and custom accelerators (AI XPUs), revolutionizing the industry. Broadcom prioritizes delivering open, scalable and power efficient systems with exceptional performance across cloud environments, data centers, and networking systems. Broadcom understands the vital role of equipping its partners with leading network infrastructure to deliver transformative AI technology. ## AI Insights ### [Broadcom Brings Open, High-Performance AI Networking to SC26](https://www.broadcom.com/company/news/articles/ai-infrastructure/broadcom-brings-open-high-performance-ai-networking-to-sc26) ![3D rendering of an advanced AI microchip module illuminated by a high-speed optical beam of light on a dark circuit surface.](https://www.broadcom.com/media/blt4ac44e0e6c6d8341/blt691baf6bcf568a9e/6af25fdfb05ce7614517094a/Broadcom_Brings_Open_High-Performance_AI_Networking_to_SC26.jpg?width=400) Theater sessions, partner demos, and a first-of-its-kind fabrics workshop show how Ethernet scales AI and HPC from the rack to the data center ### [Scaling AI Beyond the Data Center](https://www.broadcom.com/company/news/articles/ai-infrastructure/scaling-ai-beyond-data-center-buffer-depth-multi-site-clusters) ![3D digital illustration of a multi-layered server chassis and internal architectural blocks traversed by high-speed fiber data streams with numerical packet tags.](https://www.broadcom.com/media/blt4ac44e0e6c6d8341/blta303721bd8b5ccd3/6aea63d07111f57cad2f7178/Scaling_AI_Beyond_the_Data_Center.jpeg?width=400) AI training is outgrowing the building it started in. As GPU clusters spread across campuses and regions, the reactive congestion control that intra-building networks rely on starts to give way. Fiber adds roughly 100 microseconds of round-trip time for every 10 kilometers of ... ### [SUE-T: Completing the Common Path to Ethernet Scale-Up](https://www.broadcom.com/company/news/articles/ethernet/sue-t-completing-common-path-ethernet-scale-up) ![Glowing green central microchip surrounded by illuminated circuit board traces and geometric data nodes on a dark motherboard](https://www.broadcom.com/media/blt4ac44e0e6c6d8341/bltd0bc91d0925d6d04/6ae37936aaf351e13d2d964f/SUE-T-_Completing_the_common_path_to_Ethernet_scale-up.jpg?width=400) This month’s publication of the Scale-Up Ethernet Transport Base Specification (SUE-T) [1], together with the recent publication of the Ethernet for Scale-up Networking Base Specification (ESUN) [2], opens a new chapter in the evolution of AI/ML infrastructure. Developed under ... ### [2026 OCP Global Summit: Broadcom Advances Open Ethernet for Scalable AI Infrastructure](https://www.broadcom.com/company/news/articles/ai-infrastructure/ocp-global-summit-2026-broadcom-advances-open-ethernet-scalable-ai) ![3D rendering of an advanced semiconductor microchip illuminated by blue circuit lines on a futuristic motherboard.](https://www.broadcom.com/media/blt4ac44e0e6c6d8341/blt187fe67f2bae742f/6ae29e3b71d08758200032ab/2026_OCP_Global_Summit-_Broadcom_Advances_Open_Ethernet_for_Scalable_AI_Infrastructure.jpeg?width=400) With Ethernet scale-up already in production at more than five hyperscalers, the industry is building one fabric for scale-up, scale-across, and scale-out AI networks ### [Scaling AI Infrastructure with Integrated Optics](https://www.broadcom.com/company/news/articles/optics/scaling-ai-infrastructure-with-integrated-optics) ![Scaling AI Infrastructure with Integrated Optics](https://www.broadcom.com/media/blt4ac44e0e6c6d8341/bltde7b5b845ca5686e/6ad7d9ec18f58c537d766b0d/70569_-_MCO_-_Integrated_Optics_blog_hero_%281%29.jpg?width=400) As copper interconnects reach their physical reach and power limits at higher data rates, next-generation AI data centers require a new approach to scaling compute. Integrated optics provides the path forward, overcoming electrical bottlenecks to deliver the reach, power ... ### [The Future of AI Infrastructure: Why Ethernet and Optical Connectivity Are Redefining Scale-Up Networks](https://www.broadcom.com/company/news/articles/ai-infrastructure/the-future-of-ai-infrastructure-why-ethernet-and-optical-connectivity-are-redefining-scale-up-networks) ![The Future of AI Infrastructure: Why Ethernet and Optical Connectivity Are Redefining Scale-Up Networks](https://www.broadcom.com/media/blt4ac44e0e6c6d8341/blt7c668c3ecc4c21ed/6ac56165512a6de824e3541b/GettyImages-2226243269_%281%29_%281%29_%281%29.jpg?width=400) The AI industry is in the midst of a connectivity revolution. As AI clusters grow from dozens of GPUs to hundreds and thousands, the physical and architectural limits of traditional networking are being pushed to their breaking point. The industry is now deploying clusters of ... ### [AST Completes Singapore's First High-End FC-BGA Substrate Facility to Meet Growing AI Chip Demand](https://www.broadcom.com/company/news/articles/ai-infrastructure/ast-completes-singapores-first-high-end-fc-bga-substrate-facility) ![AST Completes Singapore's First High-End FC-BGA Substrate Facility to Meet Growing AI Chip Demand](https://www.broadcom.com/media/blt4ac44e0e6c6d8341/blte88673bfc3f77ff3/6aba96d582545e2ffa57890f/AST_Photo_Press_Release.jpg?width=400) Advanced Substrate Technologies (AST) today announced the official opening of its new manufacturing facility in Singapore, the first in the country capable of producing high-end Flip Chip Ball Grid Array (FC-BGA) substrates, and the TOPPAN Group’s first such facility outside ... ### [MRC: The Journey from Concept to Open Specification](https://www.broadcom.com/company/news/articles/ai-infrastructure/mrc-the-journey-from-concept-to-open-specification) ![MRC: The Journey from Concept to Open Specification](https://www.broadcom.com/media/blt4ac44e0e6c6d8341/blte63a3e3946d78a85/6a7baa3ab8c2e65f43be4701/Gemini_Generated_Image_kc762xkc762xkc76.jpg?width=400) Every industry-wide initiative has a story behind how it was conceived and the path to being released. Long before any specification is published or adopted there is a journey, with early discussions around the need, evolving ideas, and a collaboration among individuals and ... ### [Scale-Across AI Networking Needs Deep Buffer Switches: Separating Myth from Reality](https://www.broadcom.com/blog/scale-across-ai-networking-needs-deep-buffer-switches-separating-myth-from-reality) ![1440_preset](https://www.broadcom.com/media/blt4ac44e0e6c6d8341/bltfcef5863e214870d/6a5678c63a18f7667551520d/1440.jpg?width=400) As AI models continue to grow exponentially, the infrastructure required to train them has hit a physical wall: power constraints. Because you can no longer fit hundreds of thousands of GPUs into a single data center facility due to power limitations, the industry is migrating ... ## Executive Videos on AI - [Enabling AI Infrastructure (27 min 11 sec)](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6349395906112) - [Scalable AI Networks​ (24 min 41 sec)](https://www.broadcom.com/video/6349348789112) - [AI Server Interconnect (12 min 10 sec)](https://www.broadcom.com/video/6349348751112) - [Optical Interconnects​ (15 min 09 sec)](https://www.broadcom.com/video/6349348556112) - [Foundational Technology​ for AI Interconnect (14 min)](https://www.broadcom.com/video/6349347405112) - [Custom Accelerators (XPUs)​ (21 min 06 sec)](https://www.broadcom.com/video/6349347406112) ## Executive Insights ### [Tomahawk 6 – Davisson Launch](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6384157343112) Third-Generation Co-Packaged Optics (CPO) Ethernet Switch ### [Introducing Scale-Up Ethernet (SUE)](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6384162240112) Standards-based Specification for High-Performance XPU Interconnect ### [Introducing Tomahawk 6](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6384251238112) World’s First 102.4 Tbps Ethernet Switch ### [Making AI Real](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6354316143112) Dell Technologies World 2024 ### [MWC Barcelona 2024](https://www.youtube.com/watch?v=Q3YvytLp7tY) Charlie Kawwas, President of the Semiconductor Solutions Group, sits down with theCUBE for a conversation ### [Networking the AI Future](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6354037142112) Ethernet's Role in Scaling AI Infrastructure ### [Six-Five: “Enabling AI Infrastructure”](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6351055123112) Investor Meeting 2024 - Episode 209 For providers contending with the ever-increasing demand for generative AI clusters, the key to success will be a network-centric platform, based on open solutions, that scales at the lowest power. The innovations we've introduced extend our leadership for custom AI accelerators, Ethernet, PCI Express and optical interconnect portfolios. Built on our world-class foundational technologies like SerDes and DSP, they provide the best custom XPUs and merchant networking solutions enabling AI infrastructure. Charlie Kawwas President, Semiconductor Solutions Group, Broadcom ## Featured Technologies ### 3.5D XDSiP™ Platform Technology">Innovative multi-dimensional stacked die platform for AI XPUs. - [Learn about custom silicon](https://www.broadcom.com/info/ai/3point5d) ### Merchant Silicon Networking Chips">Leading-edge Ethernet for scale-up / scale-out AI networking. - [Discover networking chips](https://www.broadcom.com/info/switching/merchant-silicon) ### Tomahawk® 6 – Davisson">102.4-Tb/s Multilayer CPO Switch with 200G SerDes. - [Innovative CPO switches](https://www.broadcom.com/products/fiber-optic-modules-components/co-packaged-optics/switches/bcm78919) ### Sian3 DSP">3-nm CMOS 1.6T (8:8) PAM-4 Transceiver PHY with Integrated Laser Driver. - [Advanced DSP technology](https://www.broadcom.com/products/ethernet-connectivity/phy-and-poe/optical/bcm83628) ### PCIe Gen 6 Solutions">Simplified interoperability and system design for open AI infrastructure - [Performance Ethernet adapters](https://www.broadcom.com/info/pcie/gen-6-portfolio) ## Demo Showcase - [Tomahawk 5 and Jericho3AI](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6355310226112) - [Open AI Server Interconnect: PCIe Switching](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6355310285112) - [200G VCSEL](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6355313877112) - [Condor 200G SerDes](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6355444540112) - [Co-Packaged Optics Ethernet Switch](https://players.brightcove.net/6415665063001/Vh8ALpkmx_default/index.html?videoId=6355443950112) - 3.5D XDSiP™ Platform Technology ## Resources ### News Releases - [Broadcom Redefines AI Infrastructure with Industry-Leading Networking Innovations at 2026 OCP Global Summit](https://www.broadcom.com/company/news/product-releases/64756) - [AST Completes Singapore's First High-End FC-BGA Substrate Facility to Meet Growing AI Chip Demand](https://www.broadcom.com/company/news/releases/ast-broadcom-toppan-open-substrate-facility) - [OpenAI and Broadcom Unveil LLM-Optimized Intelligence Processor](https://www.broadcom.com/company/news/product-releases/64506) - [Broadcom Announces Extended Partnership with Meta to Deploy Technology to Support Multi-Gigawatts of Meta’s Custom Silicon, MTIA](https://www.broadcom.com/company/news/product-releases/64236) - [Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026](https://www.broadcom.com/company/news/product-releases/64036) - [Broadcom Now Shipping World’s First 102.4 Tbps Switch in Production Volume](https://www.broadcom.com/company/news/product-releases/64031) - [Optical Scale-up Consortium Established to Create an Open Specification for AI Infrastructure Led by Founding Members AMD, Broadcom, Meta, Microsoft, NVIDIA and OpenAI](https://www.broadcom.com/company/news/product-releases/optical-scale-up-consortium-established-to-create-an-open-specification-for-ai-infrastructure) - [Broadcom Delivers Industry’s First 400G/lane Optical DSP for Next-Generation AI Networks](https://www.broadcom.com/company/news/product-releases/64016) - [Broadcom Ships 3.5D Face-to-Face Compute SoC Powering AI Revolution](https://www.broadcom.com/company/news/product-releases/63946) - [Broadcom Introduces Industry’s First 800G AI Ethernet NIC](https://www.broadcom.com/company/news/product-releases/63641) - [OpenAI and Broadcom announce strategic collaboration to deploy 10 gigawatts of OpenAI-designed AI accelerators](https://www.broadcom.com/company/news/product-releases/63631) - [Broadcom Announces Tomahawk® 6 – Davisson, the Industry’s First 102.4-Tbps Ethernet Switch with Co-Packaged Optics](https://www.broadcom.com/company/news/product-releases/63626) - [Broadcom Delivers the Future of AI Infrastructure with End-to-End AI Networking Solutions at 2025 OCP Global Summit](https://www.broadcom.com/company/news/product-releases/63621) - [Broadcom Showcases Industry-Leading Quality and Reliability of Co-Packaged Optics](https://www.broadcom.com/company/news/product-releases/63616) - [Broadcom Ships Jericho4, Enabling Distributed AI Computing Across Data Centers](https://www.broadcom.com/company/news/product-releases/63361) - [Broadcom Ships Tomahawk Ultra: Reimagining the Ethernet Switch for HPC and AI Scale-up](https://www.broadcom.com/company/news/product-releases/63341) - [Broadcom Ships Tomahawk 6: World’s First 102.4 Tbps Switch](https://www.broadcom.com/company/news/product-releases/63146) - [Broadcom Announces Third-Generation Co-Packaged Optics (CPO) Technology with 200G/lane Capability](https://www.broadcom.com/company/news/product-releases/63126) - [Broadcom Advances Optical Connectivity for AI Infrastructure with Industry-Leading Solutions at OFC 2025](https://www.broadcom.com/company/news/product-releases/63021) - [Broadcom Extends PCIe Industry Leadership with End-to-End Gen 6 Portfolio for AI Infrastructure](https://www.broadcom.com/company/news/product-releases/62886) - [Broadcom Delivers Industry’s First 3.5D F2F Technology for AI XPUs](https://www.broadcom.com/company/news/product-releases/62691) - [Broadcom Delivers On AI Infrastructure Vision with Industry-Leading Solutions at 2024 OCP Global Summit](https://www.broadcom.com/company/news/product-releases/62611) - [Broadcom Delivers Industry Leading 200G/lane DSP for Gen AI Infrastructure](https://www.broadcom.com/company/news/product-releases/62491) - [Broadcom Revolutionizes AI Networking Landscape with High-Performance 400G RoCE/RDMA Ethernet NICs](https://www.broadcom.com/company/news/product-releases/62216) - [Broadcom Extends Leadership in Custom Accelerators and Merchant Networking Solutions for AI Infrastructure](https://www.broadcom.com/company/news/product-releases/61981) - [Broadcom Delivers Industry’s First 51.2-Tbps Co-Packaged Optics Ethernet Switch Platform for Scalable AI Systems](https://www.broadcom.com/company/news/product-releases/61946) - Broadcom Extends Technology and Volume Leadership on AI Optical Components - [Broadcom Extends AI Workload Scale with Industry-First PCI Express Gen5/Gen6 Retimers](https://www.broadcom.com/company/news/product-releases/61891) - [Broadcom Extends Technology and Volume Leadership on AI Optical Components](https://www.broadcom.com/company/news/product-releases/61941) ## Also of Interest - [Custom Silicon](https://www.broadcom.com/products/custom-silicon) - [AI Accelerator XPU Custom Compute](https://www.broadcom.com/info/ai/3point5d) - [AI Solutions AI Clusters Edge AI](https://www.broadcom.com/solutions/ai-solutions)